
SiGe, High-Linearity, 2300MHz to 4000MHz
Downconversion Mixer with LO Buffer
ABSOLUTE MAXIMUM RATINGS
V CC to GND..........................................................-0.3V to +5.5V
IF+, IF-, LOBIAS, IFBIAS to GND ............. -0.3V to (V CC + 0.3V)
RF, LO Input Power ....................................................... +12dBm
RF, LO Current
(RF and LO is DC shorted to GND through balun) ........50mA
Continuous Power Dissipation (Note 1) .................................5W
B JA (Notes 2, 3) ............................................................ +38 N C/W
B JC (Notes 1, 3) ............................................................ +13 N C/W
Operating Case Temperature Range
(Note 4).................................................. T C = -40 N C to +85 N C
Junction Temperature .....................................................+150 N C
Storage Temperature Range............................ -65 N C to +150 N C
Lead Temperature (soldering, 10s) ................................+300 N C
Note 1: Based on junction temperature T J = T C + ( B JC x V CC x I CC ). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150 N C.
Note 2: Junction temperature T J = T A + ( B JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150 N C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Note 4: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, R1 = 698 ω , R2 = 604 ω, V CC = 4.75V to 5.25V, no input RF or LO signals. T C = -40 N C to +85 N C, unless
otherwise noted. Typical values are at V CC = 5.0V, T C = +25 N C, all parameters are production tested.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
Supply Current
V CC
I CC
Total supply current
4.75
5.0
230
5.25
247
V
mA
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit , R1 = 845 ω , R2 = 1.1k ω, V CC = 3.0V to 3.6V, no input RF or LO signals. T C = -40 N C to +85 N C, unless oth-
erwise noted. Typical values are at V CC = 3.3V, T C = +25 N C, parameters are guaranteed by design, unless otherwise noted.) (Note 5)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V CC
I CC
CONDITIONS
Total supply current
MIN
3.0
TYP
3.3
150
MAX
3.6
UNITS
V
mA
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER
RF Frequency Range
LO Frequency
SYMBOL
f RF
f LO
(Notes 5, 6)
(Notes 5, 6)
CONDITIONS
MIN
2300
2600
TYP
MAX
4000
4300
UNITS
MHz
MHz
Using a Mini-Circuits TC4-1W-17 4:1
transformer as defined in the Typical
Application Circuit , IF matching components
100
500
IF Frequency
f IF
affect the IF frequency range (Notes 5, 6)
Using a Mini-Circuits TC4-1W-7A 4:1
transformer as defined in the Typical
Application Circuit , IF matching components
50
250
MHz
affect the IF frequency range (Notes 5, 6)
LO Drive
P LO
-3
0
+3
dBm
2
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